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基于金屬銷釘封裝的Ka波段固態(tài)功率放大模塊研究

孫健健,  徐建華,  成海峰,  祝慶霖,  韓煦

孫健健, 徐建華, 成海峰, 祝慶霖, 韓煦. 基于金屬銷釘封裝的Ka波段固態(tài)功率放大模塊研究[J]. 電子與信息學(xué)報(bào), 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
引用本文: 孫健健, 徐建華, 成海峰, 祝慶霖, 韓煦. 基于金屬銷釘封裝的Ka波段固態(tài)功率放大模塊研究[J]. 電子與信息學(xué)報(bào), 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791
Citation: Jianjian SUN, Jianhua XU, Haifeng CHENG, Qinglin ZHU, Xu HAN. Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails[J]. Journal of Electronics & Information Technology, 2020, 42(12): 3074-3080. doi: 10.11999/JEIT190791

基于金屬銷釘封裝的Ka波段固態(tài)功率放大模塊研究

doi: 10.11999/JEIT190791

  • 南京電子器件研究所 南京 210016

詳細(xì)信息
    作者簡介:

    孫健健：男，1993年生，碩士，研究方向?yàn)槲⒉ê撩撞娐?/p>

    徐建華：男，1977年生，高級工程師，主要研究方向?yàn)槲⒉ê撩撞娐?/p>

    成海峰：男，1983年生，高級工程師，主要研究方向?yàn)槲⒉ê撩撞娐?/p>

    祝慶霖：男，1989年生，工程師，主要研究方向?yàn)槲⒉ê撩撞娐?/p>

    韓煦：男，1985年生，高級工程師，主要研究方向?yàn)槲⒉ê撩撞娐?/p>

    通訊作者:

    徐建華　xu_jh55suo@163.com

  • 中圖分類號: TN772

Research on Ka-band Solid-state Power Amplifier Module Packages Using a Lid of Nails

  • Nanjing Electronic Devices Institute, Nanjing 210016, China

  • 摘要: 為了抑制一定頻帶內(nèi)的平行板和腔體諧振模式，提高功率放大器工作的穩(wěn)定性。該文提出了一種人工磁導(dǎo)體(AMC)邊界作為腔體封裝的Ka波段固態(tài)功率放大模塊。人工磁導(dǎo)體邊界通過周期性金屬銷釘構(gòu)成的電磁帶隙(EBG)抑制結(jié)構(gòu)實(shí)現(xiàn)。對Ka波段固態(tài)功率模塊進(jìn)行了設(shè)計(jì)、加工、裝配和測試。由仿真和測試得到的S參數(shù)數(shù)據(jù)，詳細(xì)地評估討論了該封裝的性能。通過對比其他封裝結(jié)構(gòu)，功率模塊的無源測試結(jié)果證明金屬銷釘封裝可以有效抑制腔體諧振，提高功放模塊隔離度。功率模塊的有源功率測試則表明金屬銷釘封裝不會(huì)影響放大器輸出功率。
    Abstract: In order to dampen the parallel plate modes and cavity modes within the frequency range of interest, and improve the stability of power amplifiers, a Ka-band solid-state power amplifier module, which is packaged with an Artificial Magnetic Conductors (AMC) boundary is presented in this paper. The AMC boundary is realized with Electromagnetic Band Gap (EBG) which is constructed by a period of metal nails in this paper. A Ka-band solid-state power amplifier module is designed, fabricated, assembled and measured. Performances of the packages are evaluated and discussed in detail on the basis of a series of S-parameter simulations and measurements. By compare with other packaging conditions, an improved module isolation and a suppressed cavity resonance are observed from passive measured results. Active measured results indicate that the package does not interfere with output power of the amplifier.
    • HTML全文

  • 圖  1  傳統(tǒng)金屬平板封裝Ka波段固態(tài)功率模塊3維模型

    圖  2  波導(dǎo)到微帶探針過渡尺寸

    圖  3  波導(dǎo)到微帶探針過渡結(jié)構(gòu)S參數(shù)仿真結(jié)果

    圖  4  Ka波段功放模塊銷釘封裝結(jié)構(gòu)

    圖  5  銷釘陣列平行面波導(dǎo)結(jié)構(gòu)(剖面圖)

    圖  6  無限大銷釘陣列平行面波導(dǎo)結(jié)構(gòu)色散曲線

    圖  7  Ka波段功率模塊實(shí)物

    圖  8  裝配了石英探針的功率模塊S參數(shù)仿真與測試結(jié)果

    圖  9  金屬銷釘高度d參數(shù)掃描仿真結(jié)果

    圖  10  包含芯片槽和不含芯片槽腔體S參數(shù)仿真結(jié)果

    圖  11  Ka波段功率模塊S參數(shù)測試結(jié)果

    圖  12  3種封裝下Ka波段功率模塊飽和輸出功率測試結(jié)果

    表  1  封裝腔體本征模諧振頻率仿真結(jié)果(GHz)

    包含銷釘陣列不含銷釘陣列
    25.131.8
    25.542.3
    26.752.8
    27.554.6
    49.856.4
    52.557.7
    下載: 導(dǎo)出CSV
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  • 收稿日期:  2019-10-16
  • 修回日期:  2020-05-24
  • 網(wǎng)絡(luò)出版日期:  2020-07-14
  • 刊出日期:  2020-12-08

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