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諧振式微型電場傳感器芯片級真空封裝及測試

諧振式微型電場傳感器芯片級真空封裝及測試[J]. 電子與信息學(xué)報, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105
引用本文: 諧振式微型電場傳感器芯片級真空封裝及測試[J]. 電子與信息學(xué)報, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105
Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105
Citation: Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor[J]. Journal of Electronics & Information Technology, 2015, 37(9): 2282-2286. doi: 10.11999/JEIT150105

諧振式微型電場傳感器芯片級真空封裝及測試

doi: 10.11999/JEIT150105
基金項目: 

國家自然科學(xué)基金(61101049, 61327810)

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor

  • 摘要: 為了降低傳感器的驅(qū)動電壓，提高該器件的品質(zhì)因數(shù)和信噪比，該文研究封裝材料和工藝對真空封裝性能的影響，針對一種微機(jī)電系統(tǒng)(MEMS)諧振式微型電場敏感結(jié)構(gòu)芯片，采用獨(dú)特的共晶鍵合技術(shù)，實現(xiàn)該傳感器的芯片級真空封裝。實驗結(jié)果表明，該傳感器封裝后的品質(zhì)因數(shù)達(dá)到了30727.4，是常壓封裝的500倍；該封裝器件具有更低的驅(qū)動電壓，只需要直流分量100 mV和交流分量60 mVp-p，與常壓測試時相比，分別只有原來的1/200和1/16。
    Abstract: In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.
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  • 羅福山. 肯尼迪航天中心的雷電防護(hù)系統(tǒng)[J]. 世界導(dǎo)彈與航天, 1991(3): 43-46.
    Luo Fu-shan. The lightning protection system of Kennedy Space Center[J]. Missiles and Spacecraft, 1991(3): 43-46.
    Luo Fu-shan. The principle of micro-rocket electric field instrument and its application[J]. Chinese Journal of Geophysics, 2000, 43(5): 616-620.
    Patrick S R, Karen L S, Richard S, et al.. Electrostatic charge and field sensors based on micromechanical resonators[J]. Journal of Microelectromechanical Systems, 2003, 12(5): 577-589.
    Wijeweera G, Bahreyni B, Shafai C, et al.. Micromachined electric-field sensor to measure AC and DC fields in power systems[J]. IEEE Transactions on Power Delivery, 2009, 24(3): 988-995.
    Yang Peng-fei, Peng Chun-rong, Fang Dong-ming, et al.. Design, fabrication and application of an SOI-based resonant electric field microsensor with coplanar comb-shaped electrodes[J]. Journal of Mciromechanics and Microengineering, 2013, 23(5): 266-285.
    Yang Peng-fei, Peng Chun-rong, Zhang Hai-yan, et al.. A high sensitivity SOI electric-field sensor with novel comb-shaped microelectrodes[C]. The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Beijing, China, 2011: 1034-1037.
    Wen Xiao-long, Peng Chun-rong, Fang Dong-ming, et al.. High performance electric field micro sensor with combined differential structure[J]. Journal of Electronics (China), 2014, 31(2): 143-150.
    Bahreyni B, Wijeweera G, Shafai C, et al.. Analysis and design of a micromachined electric-field sensor[J]. Journal of Microelectromechanical Systems, 2008, 17(1): 31-36.
    劉雪松, 閆桂珍, 郝一龍, 等. 用于MEMS器件芯片級封裝的金-硅鍵合技術(shù)研究[J]. 微納電子技術(shù), 2003(增): 238-240.
    Liu Xue-song, Yan Gui-zhen, Hao Yi-long, et al.. Investigation on Au-Si wafer bonding for MEMS device packaging[J]. Micronanoelectronic Technology, 2003(Suppl.): 238-240.
    張東梅, 丁桂甫, 汪紅, 等. 基于Sn/Bi合金的低溫氣密性封裝工藝研究[J]. 功能材料與器件學(xué)報, 2006, 11(3): 211-214.
    Zhang Dong-mei, Ding Gui-fu, Wang Hong, et al.. Low temperature hermetic bonding process based on electrodeposited Sn/Bi alloy[J]. Journal of Functional Materials and Devices, 2006, 11(3): 211-214.
    Chiao Mu and Lin Li-wei. Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding[J]. Journal of Microelectromechanical Systems, 2006, 15(3): 515-522.
    Sparks D R, Massoud-Ansari S, and Najafi N. Chip-level vacuum packaging of micromachines using NanoGetters[J]. IEEE Transactions on Advanced Packaging, 2003, 26(3): 277-282.
    Du Xian-feng, Zhang Da-cheng, and Lee Ting. Chip level packaging for MEMS using silicon cap[C]. IEEE/CPMT/ SEMI 29th International Electronics Manufacturing Technology Symposium, San Jose, CA, USA, 2004: 342-344.
    Cheng Pang, Zhan Zhao, Zhen Fang, et al.. Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors[J]. Sensors and Actuators A: Physical, 2008, 147(2): 672-676.
    彭春榮, 龔超, 陳賢祥, 等. 靜電梳齒激勵差分檢測式微型電場傳感器[J]. 中國機(jī)械工程, 2005, 16(增刊): 171-173.
    Peng Chun-rong, Gong Chao, Chen Xian-xiang, et al.. Electric field micro-sensor based on electrostatic comb-driven and differential detecting[J]. China Mechanical Engineering, 2005, 16(Suppl.): 171-173.
    Tang W C, Nguyen T H, and Howe R T. Laterally driven polysilicon resonant microstructures[J]. Sensors Actuators, 1989(20): 25-32.
    楊鵬飛, 彭春榮, 張海巖, 等. SOI微型電場傳感器的設(shè)計與測試[J]. 電子與信息學(xué)報, 2011, 33(11): 2771-2774.
    Yang Peng-fei, Peng Chun-rong, Zhang Hai-yan, et al.. Design and testing of a SOI Electric-field Microsensor[J]. Journal of Electronics Information Technology, 2011, 33(11): 2771-2774.
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出版歷程
  • 收稿日期:  2015-01-20
  • 修回日期:  2015-04-14
  • 刊出日期:  2015-09-19

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