封裝微帶電路網(wǎng)絡特性的矩量法分析
The Network Characteristic Analyses of the Packaged Microstrip Circuits by Using MoM
-
摘要: 該文首先對封裝微帶電路建立了以混合位積分方程(MPIE)描述的矩量法(MoM)分析模型，采用了復鏡像技術，準確計算了Green函數(shù)并表達為簡潔閉式。進而考慮了邊壁對電路的影響，計算并修正了阻抗矩陣。在此研究的基礎上，該文將Eleftheriades(1996)中的模型擴展為封裝模型，提取出封裝微帶電路的網(wǎng)絡特性，最后的數(shù)值結果表明封裝效應對微帶電路的網(wǎng)絡特性有著很重要的影響。Abstract: In this paper, a Method of Moments (MoM) model of packaged microstrip circuit is presented, which is described by Mixed Potential Integral-Equation (MPIE). The Greens functions of a horizontal electric dipole for the covered microstrip circuits can be expressed as the closed form by the Discrete Complex Image Method (DCIM). Then the influence of the enclosure side walls is considered by the equivalent image currents and the impendence matrix is modified further. Finally, the Eleftheriades(1996) model is extended to package model and the packaged microstrip network characteristics are extracted. The numerical results show the package effect could make an important difference on the network characteristics of the microstrip circuits.
-
計量
- 文章訪問數(shù): 2307
- HTML全文瀏覽量: 102
- PDF下載量: 638
- 被引次數(shù): 0
下載:
