p-InP/Ag-Zn/Mn系的接觸特性及其應(yīng)用
CONTACT CHARACTERISTICS OF THE p-InP/Ag-Zn/Mn SYSTEM AND APPLICATION
-
摘要: 本文研究了p-InP/Ag-Zn/Mn系的接觸特性和界面互擴(kuò)散問(wèn)題。結(jié)果表明:該系的比接觸電阻與Au-Zn系相當(dāng)。而Ag的內(nèi)擴(kuò)散程度較Au低,有利于器件可靠性的改善。該系用作InGaAsP/InP邊發(fā)光管的p面電極,器件的Rs4--6。
-
關(guān)鍵詞:
- 比接觸電阻; 合金化; 互擴(kuò)散
Abstract: The contact characteristics and the interdiffusion of p-InP/Ag-Zn/Mn system are investigated by four-probe method and Auger electroscopy. The surface morphology of the heat treatment sample is observed by SEM. The specific contact resistance (ec) which is function of the alloy temperature and time is also given. The (ec(2-4)10-4cm at 400. The Ag-Zn/Mn system already is used in the InGaAsP/InP Edgeemitting LEDS, Rs4-6. The results shown that the Ag-Mn material is stable and reproducible. -
E. Kuphal, Solid-state Electronics, 24(1981), 69.[2]A. K. Chin, et al., Jpn. J. Appl. Phys., 8(1981), 1487.[3]張桂成等,電子科學(xué)學(xué)刊,2(1984),174.[4]H. Temkin, et al., Appl. Phys. Lett., 36 (1980), 444.[5]A. K. Chin, et al., Appl. Phys. Lett., 41 (1982), 555.[6]張桂成等,發(fā)光與顯示,1(1985), 5.[7]W. Tseng, et al., J. Vac. Sci. Technol., 19 (1981), 623.[8]A. J. Volois, et al., Solid-state Electronics, 25(1982), 973. -
計(jì)量
- 文章訪問(wèn)數(shù): 2060
- HTML全文瀏覽量: 117
- PDF下載量: 355
- 被引次數(shù): 0
下載:
