用堆集掩模技術(shù)制造變厚超導(dǎo)微橋
FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE
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摘要: 本文介紹了一種制作變厚超導(dǎo)微橋的新方法。用此方法變厚超導(dǎo)微橋通過(guò)一次光刻、用三個(gè)坩堝、不必打開(kāi)鍍膜機(jī)就能制成。利用普通接觸式紫外曝光設(shè)備和斜蒸發(fā)技術(shù),使橋區(qū)達(dá)到亞微米尺寸。并獲得了無(wú)迴滯的直流I-V特性。
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關(guān)鍵詞:
Abstract: A pile-up masking technique using the conventional optical lithography and a two-step or three-step evaporation process is developed to fabricate the variable thickness superconducting microbridges of submicron. The l-V characterise of the microbridges made by the technique is measured at 4.2 k. -
P. C.Chao et al., IEEE Trans. on EDL, EDL-3(1982), 286.[2]L. B. Holdeman et al., J. Vac. Sci. Technol., 4(1985), 956.[3]時(shí)賢慶等,中國(guó)真空學(xué)會(huì)第5屆真空應(yīng)用學(xué)術(shù)會(huì)議論文集,1986, 133.[4]M. Hatzakis et al., IBM J. Res. Develop., 24(1980), 452. -
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