陶瓷-金屬封接用鈦銀銅合金焊料含鈦量及其封接工藝的研究
THE STUDY OF TITANIUM CONTENT IN TITANIUM-SILVERCOPPER ALLOY SOLDER AND SEALING TECHNOLOGY FOR CERAMIC-METAL SEAL
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摘要: 正 (一) 前言 幾十年來電真空器件一直采用鉬錳金屬化或涂鈦粉的陶瓷金屬封接工藝。該工藝比較復雜,同時封接質(zhì)量又不易保證。我們研究了用鈦銀銅(Ti-Ag-Cu)活性合金焊料直接封接的工藝;試驗了合金焊料中活性元素鈦含量和封接溫度等參量對封接質(zhì)量的影響;給出了合金焊料的合適合鈦量和封接的工藝規(guī)范。實驗表明,鈦銀銅合金焊料直接封接工藝,方法簡單,質(zhì)量穩(wěn)定,是值得推廣應用的
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關鍵詞:
Abstract: For a long time Mo-Mn metallization with Ti-powder coating ceramicmetal sealing technologies have been used in the production of vacuum devices. But these technologies are quite complex and the sealing quality is hardly guaranteed. Some reseaches on the direct sealing technology using Ti-Ag-Cu active alloy solder are carried out, with the influence of the content of the active element Ti, the sealing temperature and other parameters on the seal quality suitably investigated. Suitable Ti content in the alloy solder and specifications for sealing are given . The experimental results prove that the direct sealing technology using Ti-Ag-cu alloy solder is not complex and seal quality is stable. -
高鹽治南,窯業(yè)協(xié)會志,78(1970), 350.[3]高鹽治南,窯業(yè)協(xié)會志,83(1975), 411.[4]劉聯(lián)寶等編,電真空器件的釬焊與陶瓷金屬封接,國防工業(yè)出版社,1978年,第183頁. -
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